Siemens 6ES7193-6PA00-0AA0 SIMATIC ET 200SP Server Module

Parameter

Model: 6ES7193-6PA00-0AA0 SIMATIC ET 200SP Server Module
Horizontal Installation Temp: -30 °C to +60 °C
System Load Support: Up to 64 I/O modules per station
Max. Operational Altitude: 5 000 m above sea level (Derating applies > 2000 m)
Minimum Air Humidity Dew Point: -60 °C (Validated for extreme dry room use)
Protection Enclosure Class: IP20 Rating
Rail Compatibility: Standard DIN profile mounting rail

Description

The Siemens 6ES7193-6PA00-0AA0 installed at the end of an ET 200SP station, it completes the backplane bus and supports proper communication within the station. The module is designed for use with compatible ET 200SP interface modules and I/O configurations, providing the required termination for reliable system operation. With its compact design, the server module integrates directly into the ET 200SP system without requiring additional wiring. It is intended for replacement or maintenance of existing installations while maintaining compatibility with the ET 200SP platform. The module is suitable for operation in ambient temperatures from -30°C to +60°C for horizontal installation and -30°C to +50°C for vertical installation. Its compact dimensions of 7 × 117 × 36 mm allow installation where cabinet space is limited. 

Frequently asked questions

What is the purpose of the server module?
The module closes the ET 200SP backplane bus, allowing the station to operate correctly and ensuring proper communication within the I/O system.

Does the server module provide any additional functions?
Yes. Besides terminating the backplane bus, it supports firmware updates, I&M identification data, Reconfiguration in RUN, and status indication for the L+ supply voltage and feedback voltage for each slot.

Can the 6ES7193-6PA00-0AA0 store device information?
Yes. The module provides retentive storage of the device name, allowing device replacement without topological configuration when used with compatible IM 155-6 PN BA interface modules.

Application areas:
Hazardous Environment Control Cabinets: Positioned at the far right of the subrack module array to seal and isolate the system backplane against electrostatic dust contamination and electromagnetic interference (EMI).

Packaging and Bottling Monoblocs: Integrated on multi-axis packaging machinery to sustain the microsecond-level backplane communication rates required for high-speed dynamic sorting and weight inspection loops.

Hot-Swapping Tool Changers: Enables real-time robotic arm end-effector tool dynamic reconfiguration under PLC RUN mode (hot swapping) without throwing global PROFINET ring network errors.

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